WAFER & CO
Flat, thin and ultra-parallel;
various applications and materials:
Available now!
Ultra-thin < 25 μm;
Ultra-flat λ/10;
Super polishing < 5 A;
Tolerances ±0,5μm;
Edgelengths from 0,12 mm up to 1000 mm;
Materials:
Aluminum Nitride, Alumina (96% and 99,6% Al²O³)
Copper, Stainless Steel, Titanium
Fused Silica, Quartz, Sapphire, Ceramics
Opt. Glass and Filterglass
Many materials in stock!
Processing of customer supplied:
Ge, GaAs, LiNbO, LiF, InP, ZnSe, ZnS, PZT, PLZT, Si, SiC
Applications:
Electrostatic, Wafer and Vacuum Chucks
Microelectronics, Electrooptics and Semiconductors
Wafers, Substrates, Windows, Flat Optics, Wedges, Discs
Spacers, Witness Samples
Services:
Precision Lapping, Polishing and Dicing, Grinding
O.D. / I.D. Polishing, Optical Edge and Angle Polishing
Ultrasonic Hole Drilling, Waterjet Cutting